Process
Fabrication of thick film hybrid microcircuits is done by the screen printing of conductive, dielectric and resistive pastes on to 96% alumina substrates. These pastes, when fired at temperatures in the range of 800°C to 1000°C, become an integral part of the substrate and form the basic structure of the hybrid microcircuit. Out of tolerance resistors can be trimmed to desired values upto 1% accuracy or more, by using air abrasive / laser technique. Functional trimming is utilised where circuit function is of prime importance compared to specific value of resistance and tolerance. Discrete components, both active and passive, are added to the substrate with the generated basic structure to complete the circuit, and finally hermetically sealed into customer desired packages

Assembly
Hybrid assembly involves taking an electronic subsystem in which a number of integrated circuits (packaged and/or unpackaged) and discrete components and attaching them directly to a common substrate. Connections between the components are formed on the surface of the substrate and some components, such as resistors and inductors, may be fabricated directly onto the substrate. Hybrid circuits provide the greatest reduction in size, and can often improve performance of critical circuits
 
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