Thick Film Technology : Thick film Hybrid microcircuit technology involves the precision screen printing and firing of conductors, resistors, Capacitors, Inductors and dielectrics onto the substrate (Alumina) building reliable multi-layer circuit using Noble Metals.
Benefits Of Hybrid circuits:
- Miniaturisation for size critical applications, through use of multi-layer circuits and standard production techniques (typically 10x reduction in size compared to printed circuit board)
- Proven technology to integrate different semiconductor technologies (e.g. power, analog, digital) in one module
- Inherent design flexibility using integrated resistors and incorporation of discrete components such as capacitors, transistors, diodes
Resistance to extreme environments using metal and ceramic packaging technology
Thick Film Technology: Thick Film technology employs photolithographic precision patterning to give a wide range of resistance values in the smallest possible area. This process is also reffered to as subtractive process through trimmer. Thick Film substrates are largely used in RF and Microwave applications for high frequency |
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